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Уведомление об обновлениях схем

Change Notification #   16249
Revision  
Type of Notification   INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Trench Die Transfer to Aizu and Gresham Wafer Fab Facilities
Issue Date   2009-05-13
Affected Product Family  
Description   This is an Initial Process Change Notification. For the listed products, this is an announcement that the ON Semiconductor’s Wafer Fab facilities in Aizu, Japan, and Gresham, Oregon, along with the current Wafer Foundry will all be sources for this Trench MOSFET Die. The Aizu Fab facility is fully certified, and has been a continuous source for MOSFET Die for over 20-years. This particular Trench MOSFET platform has been qualified in the Aizu Wafer Fab facility since May 2007. The Gresham Fab facility is also fully certified, and has been a source for MOSFET Die since January 2007.
Key Items Affected by Change   ON Semi FAB Site
 
Key Milestones  
Effective Date:   2009-09-10
Sample Info:   N/A
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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