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Уведомление об обновлениях схем

Change Notification #   16320
Revision  
Type of Notification   UPDATE NOTIFICATION
Change Title   Copper Wire in SOIC and TSSOP Packaged Products
Issue Date   2009-08-10
Affected Product Family  
Description   A Product Change Notification (PCN #16227) was published on 03-03-09 regarding the release of Copper Wire (in place of Gold Wire) on SOIC and TSSOP packages assembled at the Carmona, Philippines assembly location. This update notification is to notify customers that (4) devices were inadvertently omitted from the original PCN. Reliability Qualification and full electrical characterization over temperature has now been completed on the designated package qualification vehicles. Please reference PCN #16227 for more details.
Key Items Affected by Change   Assembly Process
 
Key Milestones  
Effective Date:   2009-08-10
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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