Уведомление об обновлениях схем
| Change Notification # |
|
16320 |
| Revision |
|
|
| Type of Notification |
|
UPDATE NOTIFICATION |
| Change Title |
|
Copper Wire in SOIC and TSSOP Packaged Products |
| Issue Date |
|
2009-08-10 |
| Affected Product Family |
|
|
| Description |
|
A Product Change Notification (PCN #16227) was published on 03-03-09 regarding the release of Copper Wire (in place of Gold Wire) on SOIC and TSSOP packages assembled at the Carmona, Philippines assembly location. This update notification is to notify customers that (4) devices were inadvertently omitted from the original PCN. Reliability Qualification and full electrical characterization over temperature has now been completed on the designated package qualification vehicles. Please reference PCN #16227 for more details.
|
| Key Items Affected by Change |
|
Assembly Process |
| |
| Key Milestones |
|
| Effective Date: |
|
2009-08-10 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|