Уведомление об обновлениях схем
| Change Notification # |
|
16396 |
| Revision |
|
|
| Type of Notification |
|
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
IC D2PAK 3 AND 5 LEAD CHANGE TO SINGLE GAGE THICKNESS HEAT SINK |
| Issue Date |
|
2010-02-12 |
| Affected Product Family |
|
|
| Description |
|
This is an advance notice that the D2Pak 3 and 5 lead product lines for IC products running in Seremban, Malaysia will be qualified for a single gage thickness heat sink.
|
| Key Items Affected by Change |
|
Package Change |
| |
| Key Milestones |
|
| Effective Date: |
|
2010-07-12 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|