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Уведомление об обновлениях схем

Change Notification #   16423
Revision   O
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Solder Die Attach replacing Epoxy Die Attach for SOT223 Package
Issue Date   2010-03-03
Affected Product Family  
Description   This is an addendum to FPCN16346 where ON Semiconductor is notifying customers of its plan to replace Epoxy Die Attach to Solder Die Attach for Bipolar Transistor used in SOT223-Epoxy package. Product change to Solder Die Attach material in the SOT223 package can be rated as MSL-1 which dry packing is no longer required instead of the current MSL-3 rating with the epoxy. Additionally, Power Devices built with solder will have improved electrical and thermal conductivity over devices built with epoxy.
Key Items Affected by Change   Die Attach Assembly
 
Key Milestones  
Effective Date:   2010-06-03
Sample Info:   Contact your local ON Semiconductor Sales Office or Masitah Aznam
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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