Уведомление об обновлениях схем
| Change Notification # |
|
16427 |
| Revision |
|
O |
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
TSSOP48 PACKAGE CONVERSION FROM BARE COPPER LEADFRAME TO PRE-PLATED LEADFRAME – ADDITIONAL LIST OF DEVICES |
| Issue Date |
|
2010-03-03 |
| Affected Product Family |
|
|
| Description |
|
This is the Final PCN located at www.onsemi.com announcing a change in lead frame from bare copper to Palladium Pre-plated leadframe for all the TSSOP48 package types, aligning with the other ON Semi TSSOP family devices. Device performance and reliability have not changed. There will be no changes to package dimensions, functionality, or data sheet specifications. This change will be effective for all the TSSOP48L products.
|
| Key Items Affected by Change |
|
ON Semiconductor Assembly and Test Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2010-06-03 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|