Уведомление об обновлениях схем
| Change Notification # |
|
16914 |
| Revision |
|
|
| Type of Notification |
|
PRODUCT BULLETIN |
| Change Title |
|
Conversion of heat seal cover tape to 3M UCT cold seal cover tape for wafer scale packaging (WSP) bare die products. |
| Issue Date |
|
2012-10-05 |
| Affected Product Family |
|
|
| Description |
|
To support ON Semiconductor’s Continuous Improvement efforts, ON Semiconductor will be
converting the Tape and Reel Cover Tape of our wafer scale packaging (WSP) bare die products
from HAA Cover Tape (Heat Activated Adhesive) to UCT Cold Seal Cover Tape (Universal Cover
Tape)
This will eliminated potential process inherent issue (torn tape, unsealing & stringing) due to heat
seal process and provide a consistence peel force with small standard deviation.
|
| Key Items Affected by Change |
|
ON Semiconductor Assembly Site |
| |
| Key Milestones |
|
| Effective Date: |
|
2012-10-25 |
| Sample Info: |
|
|
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|