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Уведомление об обновлениях схем

Change Notification #   16862
Revision   A
Type of Notification   PRODUCT BULLETIN
Change Title   SOIC-7/8, 14 Lead Conversions from MSL3 to MSL1
Issue Date   2012-11-07
Affected Product Family  
Description   Through continuous process improvement of our SOIC assembly line, ON Semiconductor would like to announce that it will be changing the Moisture Sensitivity Level for those products listed in this Bulletin from MSL3 to MSL1. This means that the product listed in this product bulletin will no longer be shipped in dry packing materials. There has been no change in the BOM material set to achieve this higher MSL rating, only improvements to the assembly process.
Key Items Affected by Change   Assembly Process Moisture Sensitivity Level (MSL)
 
Key Milestones  
Effective Date:   2012-11-12
Sample Info:   Contact your local ON Semiconductor sales office or
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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