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Уведомление об обновлениях схем

Change Notification #   16939
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Qualification of T1 FET die, used in NCP34x & NCP37x devices, at UMC Wafer Fab
Issue Date   2012-11-17
Affected Product Family  
Description   ON Semiconductor is pleased to announce the qualification for the FET die, utilized in the NCP34x and NCP37x family of devices, in United Microelectronics Corp (UMC) Wafer Fab. The FET for the NCP34x and NCP37x is currently qualified at ON Semiconductor’s Aizu wafer fab facility located in Aizu, Japan and is now qualified at UMC’s wafer fabrication facility located in Taiwan. Upon expiration (or approval) of this Final PCN, devices may be supplied by either wafer fab.
Key Items Affected by Change   Silicon Fabrication Site
 
Key Milestones  
Effective Date:   2013-02-17
Sample Info:   Contact your local ON Semiconductor Sales Office or Shilpa.Rao@onsemi.com
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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