Уведомление об обновлениях схем
| Change Notification # |
|
16950 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
MAX/ NCP 803, 809, 810 Device Families Qualification at Gresham Wafer Fab |
| Issue Date |
|
2012-12-21 |
| Affected Product Family |
|
|
| Description |
|
ON Semiconductor is pleased to announce the qualification of the MAX/ NCP 803, 309 & 810 families in ON Semiconductor’s Gresham wafer fab facility on the ONC25 technology.
These device families are currently produced at ON Semiconductor’s Aizu wafer fab facility located in Aizu, Japan. Due to the announcement of the Aizu fab closure, these device families have been redesigned using the ON Semiconductor ONC25 process and will be produced from ON Semiconductor’s Gresham wafer fabrication facility located in Gresham, Oregon. Upon expiration (or approval) of this Final PCN, devices may be supplied by either wafer fab.
|
| Key Items Affected by Change |
|
Wafer Fab Location |
| |
| Key Milestones |
|
| Effective Date: |
|
2013-03-21 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office or Shilpa.Rao@onsemi.com |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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