Уведомление об обновлениях схем
| Change Notification # |
|
20082 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Copper wire bond for IC Micro 8 package |
| Issue Date |
|
2013-05-08 |
| Affected Product Family |
|
|
| Description |
|
This FPCN is to notify customers of the planned qualification of Copper Wire (in place of Gold Wire) on the Micro 8 packages assembled at the Seremban, Malaysia assembly location. Reliability Qualification and full electrical characterization has now been completed on the designated package qualification vehicles.
|
| Key Items Affected by Change |
|
Assembly Process - Package |
| |
| Key Milestones |
|
| Effective Date: |
|
2013-08-09 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|