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Уведомление об обновлениях схем

Change Notification #   20092
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Qualification of UTAC Singapore for Bump Post-Test Production
Issue Date   2013-05-30
Affected Product Family  
Description   ON Semiconductor is pleased to announce a capacity expansion qualification of UTAC, located in Singapore, as an additional source for bump product post-test operations (wafer saw, visual inspection, tape and reel). These operations are currently performed at the ON Semiconductor facility located in Seremban, Malaysia. Upon expiration (or approval) of this FPCN, these operations may be performed at the ON Semiconductor, Malaysia facility or at the UTAC facility in Singapore.
Key Items Affected by Change  
 
Key Milestones  
Effective Date:   2013-08-31
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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