Уведомление об обновлениях схем
| Change Notification # |
|
4887 |
| Revision |
|
|
| Type of Notification |
|
PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
14/16/20L TSSOP 3-Layer Pre-Plated Frames |
| Issue Date |
|
1999-07-28 |
| Affected Product Family |
|
DISCRETES AND LOGIC |
| Description |
|
TSSOP products are being assembled using 2-layer (Ni-Pd) pre-plated lead frames or Sn-Pb from other assembly sites. Although no issue is being encountered in using the Sn-Pb or 2-layer PPF lead frames, a 3-layer PPF lead frame will further improve the process capability of the assembly line. In addition, this change will also create better wettability at the reflow process. Motorola Philippines at Carmona has qualified a 3-layer (Ni-Pd-Au) pre-plated lead frame for all the above packages. The required reliability tests results were very satisfactory.
|
| Key Items Affected by Change |
|
Assembly Process Package Change |
| |
| Key Milestones |
|
| Effective Date: |
|
1999-11-05 |
| Sample Info: |
|
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| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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